Ceramic Functional Powder
DENKA FUSED SILICA FILLER (DF) Super-Fine Spherical Particle Type (SFP-M・UFP)
Use
Semiconductor Sealant
Silicon Rubber Filling
Resin Substrate
Sintering Material
Narrow Gap Application
Abrasive Powder
Features
Average particle sizes of 0.7µm, 0.3µm, 100nm are available.
High dispersivity, and can achieve high content filling for various types of resins.
Submicron silica is suitable for reducing viscosity, increasing fluidity, and reducing flash in various types of resins and varnishes.
Nano-order silica has less cohesion (structure) than conventional fumed/precipitated silica, with excellent workability.
