Ceramic Functional Powder
DENKA FUSED SILICA (DF) SPHERICAL (FB, FBX)
Use
Fillers for semiconductor sealing epoxy resins.
Low uranium (low alpha) grades for memory applications.
Various types of resin fillers.
Sintering material and sintering agent.
Features
With its spherical shape, it will improve fluidity in resin filler applications, high content filling and improved wear resistance.
