Thermally Conductive Products
DENKA ALSINK
Use
Base boards for power modules such as IGBT and diodes that require high reliability (heat sinks).
Heat-dissipating lids for semiconductor packages such as CPUs (heat spreaders).
Components for microwave devices such as optical and communication devices.
Components for semiconductor and LCD panel manufacturing equipment.
Features
Aluminum-based composite (MMC) consisting of Al-SiC and ceramics.
Excellent material characterized by low thermal expansion, high thermal conductivity, high strength and lightweight.
