We adhere to the consistent zealous attitude and
provide the most superior service to all customers.
We specialised in trade business which involves a wide range of plastic raw materials (resin), electronic materials, semiconductors, chloroprene rubber, special element additives, injection machines, paints and etc.
Semiconductor Tape
Back Grinding Tape
Use
Wafer Back Grinding
Features
Exhibits superior adhesive quality.
Ensures stable grinding performance.
Delivers stable low particle count performance.
Exhibits stable adhesive strength, unaffected by storage time.