What we do

We adhere to the consistent zealous attitude and provide the most superior service to all customers.

We specialised in trade business which involves a wide range of plastic raw materials (resin), electronic materials, semiconductors, chloroprene rubber, special element additives, injection machines, paints and etc.

Semiconductor Tape

Back Grinding Tape

Use

Wafer Back Grinding

Features

Exhibits superior adhesive quality.

Ensures stable grinding performance.

Delivers stable low particle count performance.

Exhibits stable adhesive strength, unaffected by storage time.