We specialised in trade business which involves a wide range of plastic raw materials (resin), electronic materials, semiconductors, chloroprene rubber, special element additives, injection machines, paints and etc.
Evaluation wafer use for inspections and experiments in the pre-process of semiconductor equipment
150mm
SEMI | JEIDA | |
SPEC | 0.2um ≤ 30ea | 0.2um ≤ 30ea |
Diameter (mm) | 150 ± 0.2 mm | 150 ± 0.2 mm |
Type | P | Â P |
Orifura length | 57.5mm ± 2.5mm | 47.5mm ± 2.5mm |
Resistance value (Ω ・ cm) | 1-100 | 1-100 |
Thickness (μm) | 675um ± 25um | 675um ± 25um |
TTV (μm) | ≤ 30um | ≤ 30um |
BOW (μm) | ≤ 40um | ≤ 40um |
WARP (μm) | ≤ 40um | ≤ 40um |
Surface impurities | ≤ 5.0E 10 atom / cm2 | ≤ 5.0E 10 atom / cm2 |
200mm
SPEC | 0.2um ≤ 30ea | – – |
Diameter (mm) | 200 ± 0.2 mm | 200 ± 0.2 mm |
Type | P | Â P |
Crystal orientation | <110> ± 1 | <110> ± 1 |
Notch orientation | <110> ± 1 | <110> ± 1 |
Resistance value (Ω ・ cm) | 1-100 | 1-100 |
Thickness (μm) | 725 ± 25 | 725 ± 25 |
TTV (μm) | ≤25 | ≤2 |
BOW (μm) | ≤ 40um | ≤ 40um |
WARP (μm) | ≤ 40um | ≤ 40um |
LM | none | none |
Surface impurities | ≤ 5.0E 10 atom / cm2 | ≤ 5.0E 10 atom / cm |
300mm
SPEC | 0.045um ≤ 50ea | 0.065um ≤ 50ea | 0.09um ≤ 50ea | 0.12um ≤ 50ea |
Manufacturing method | CZ | CZ | CZ | CZ |
Diameter (mm) |  300 ± 0.2 mm |  300 ± 0.2 mm |  300 ± 0.2 mm |  300 ± 0.2 mm |
Type / Dopant | P / Boron | P / Boron | P / Boron | P / Boron |
Crystal orientation | <100> ± 1 | <100> ± 1 | <100> ± 1 | <100> ± 1 |
Notch orientation | <110> ± 1 | <110> ± 1 | <110> ± 1 | <110> ± 1 |
Resistance value (Ω ・ cm) | 1-100 | 1-100 | 1-100 | 1-100 |
Thickness (μm) | 775 ± 25 | 775 ± 25 | 775 ± 25 | 775 ± 25 |
TTV (µm) | ≤10 | ≤10 | ≤10 | ≤10 |
BOW (μm) | ≤40 | ≤40 | ≤40 | ≤40 |
WARP (μm) | ≤40 | ≤40 | ≤40 | ≤40 |
LM | T7 + OCR | T7 + OCR | T7 + OCR | T7 + OCR |
Surface impurities | <1 E10 Atoms / cm2 | <1 E10 Atoms / cm2 | <1 E10 Atoms / cm2 | <1 E10 Atoms / cm2 |