Ceramic Functional Powder
Denka Spherical Alumina
Use
Filler for semiconductor sealing material
Base powder for ceramic powder baking
Thermal spray material
Features
It is the most suitable filler for the purpose of imparting high thermal conductivity to various resins/rubbers and improving surface hardness.
Various grades with reduced ionic impurities, suitable to use in the field of electronic materials that require reliability.
Particle size particle can be adjusted according to applications